REMANUFACTURING
APSY-RIE-CCP MACHINE
Description
Remanufacturing of STS RIE CCP base.
Replacement of PCB modules with SIEMENS PLC sub-assemblies. Each module retains its control group in order to simplify interfacing between the system and its modules (gasbox, chamber).
Reintegration of etching processes into the system for etching silicon, substrates, with fluorinated for sometimes chlorinated chlorinated derivative reactive gases, sulfur hexafluoride, (SF6), carbon tetrafluoride (CF4), or trifluoromethane (CHF3).
Example of etching :
- Wafer : 4” de silicium (SIO2).
- Etetching rate : 290 Å/min.
- Uniformity : ±1.6%.
- Maximum temperature : 71°c.
The system is entirely controlled by a PLC/HMI assembly.
REMANUFACTURING
All our new systems are guaranteed for two years, on-site interventions within 48 hours, remote maintenance. Preventive maintenance at the end of the warranty period.
supervising
The functions of the program provide permanent support for monitoring the progress of the actions carried out by the system, in the form of graphic and dynamic representation, events or even curves.
Different user levels are available. Each of them controls access and secure use according to the user.
Each action, alarm or feedback is associated with a textual description of different levels, blocking or not.
These events are stored in the history.
The general interface gives you as much visible data as possible. Of type, pressures, powers, movements, statuses of the various subsets of the system, etc.
Several user functions are available: production, manual, cycles and maintenance.
