Manufacture and Maintenance
of vacuum deposition machine

It is a set of thin film deposition methods passing through a passive medium (vacuum or inert atmosphere) or active medium (plasma, reactive gas).

• Vacuum evaporation method.
• Method of sputtering.
• Vapor electron vapor evaporation method.
• Arc Deposition method.

Sputtering consists of bombarding a target with heavy and inert gas atoms (such as argon) that are ionized to form a plasma atoms and molecules of the target in order to send them to deposit on the substrate .

PECVD . Chemical vapor deposition.

Plasma-enhanced chemical vapor deposition ( PECVD ) is a process used to deposit thin films on a substrate from a gaseous state of a few seconds. tens of nanometers to several microns thick on a substrate.

For plasma-based CVD (PECVD), gas molecules dissociate under the influence of plasma. They then react with the material of the layer to deposit on the substrate.

They must be clean, especially free of grease to facilitate adhesion, with the smoothest surface possible if you want a reflective deposit.