Manufacture and refurbishment
of vacuum deposition machine

It is a set of thin film deposition methods passing through a passive evironment (vacuum or inert atmosphere) or active environment (plasma, reactive gas).

• Vacuum evaporation method.
• Sputtering method.
• Vapor phase electron beam evaporation method.
• Electric arc deposition method.

Sputtering consists of bombarding a target with heavy, inert atoms of a gas (such as argon) which are ionized to form a plasma and tearing atoms and molecules from the target to send them to deposit on the subtrate.

PECVD. Plasma-enahce chemical vapor deposition.

Plasma-Enhanced Chemical Vapor Deposition (PECVD) is a process used to deposit thin layers from a few tens of nanometers to several micrometers thick on a substrate.

For plasma-based CVD (PECVD), gas molecules dissociate under the influence of plasma. They then react to the material of the layer to deposit on the substrate.

They must be clean, in particular free of grease to facilitate adhesion, with the smoothest possible surface if a reflective deposit is desired…